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On the device is also an AF assist beam to help in low-light conditions
The clear plastic
The CY7C199D device is suitable for interfacing with processors that have TTL I/P levels
Manufacturer: ASRock
AMP - TE CONNECTIVITY 5103308-1 Wire-To-Board Connector, 2.54 mm, 10 Contacts, Header, AMP-LATCH Series, Through Hole, 2 Rows Sescom IPHONE-MIC-10 On the device is alsoThe 5103308 1 is a 10 way AMP LATCH shrouded Low Profile Header with flame retardant. It has 5000MR minimum initial insulation resistance and 1000Vrms dielectric withstanding voltage. It has low profile and wire to board connector system. Vertical PCB mounting Glass filled nylon PBT housing material Gold plated copper alloy contacts UL94V 0 flammability rating Applications Industrial, Consumer Electronics Product details No. of Contacts 10Contacts
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